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features description/ordering information am26ls31c , am26ls31m quadruple differential line driver slls114i ? january 1979 ? revised february 2006 meets or exceeds the requirements of ansi tia/eia-422-b and itu operates from a single 5-v supply ttl compatible complementary outputs high output impedance in power-off conditions complementary output-enable inputs the am26ls31 is a quadruple complementary-output line driver designed to meet the requirements of ansi tia/eia-422-b and itu (formerly ccitt) recommendation v.11. the 3-state outputs have high-current capability for driving balanced lines such as twisted-pair or parallel-wire transmission lines, and they are in the high-impedance state in the power-off condition. the enable function is common to all four drivers and offers the choice of an active-high or active-low enable (g, g) input. low-power schottky circuitry reduces power consumption without sacrificing speed. ordering information t a package (1) orderable part number top-side marking pdip ? n tube am26ls31cn am26ls31cn tube am26ls31cd soic ? d am26ls31c 0 c to 70 c tape and reel am26ls31cdr sop ? ns tape and reel am26ls31cnsr 26ls31 ssop ? db tape and reel AM26LS31CDBR sa31c cdip ? j tube am26ls31mjb am26ls31mjb ?55 c to 125 c lccc ? fk tube am26ls31mfkb am26ls31mfkb cfp ? w tube am26ls31mwb am26ls31mwb (1) package drawings, standard packing quantities, thermal data, symbolization, and pcb design guidelines are available at www.ti.com/sc/package. please be aware that an important notice concerning availability, standard warranty, and use in critical applications of texas instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. production data information is current as of publication date. copyright ? 1979?2006, texas instruments incorporated products conform to specifications per the terms of the texas instruments standard warranty. production processing does not necessarily include testing of all parameters. www .ti.com 12 3 4 5 6 7 8 1615 14 13 12 1 1 10 9 1a1y 1z g 2z 2y2a gnd v c c 4a4y 4z g 3z3y 3a d, db, n, ns, j, or w p ackage (t op view) 19 20 1 3 2 17 18 16 15 14 13 12 1 1 9 10 5 46 7 8 4y4z nc g 3z 1z g nc 2z 2y 1y1a nc v 4a gnd nc 3a3y 2a fk p ackage (t op view) cc
am26ls31c , am26ls31m quadruple differential line driver slls114i ? january 1979 ? revised february 2006 function table (1) (each driver) enables outputs input a g g y z h h x h l l h x l h h x l h l l x l l h x l h z z (1) h = high level, l = low level, x = irrelevant, z = high impedance (off) logic diagram (positive logic) 2 submit documentation feedback www .ti.com 1z 1y g g 1a 412 1 23 2z 2y 2a 7 65 3z 3y 3a 9 10 1 1 4z 4y 4a 15 1413
absolute maximum ratings (1) am26ls31c , am26ls31m quadruple differential line driver slls114i ? january 1979 ? revised february 2006 schematic (each driver) over operating free-air temperature range (unless otherwise noted) min max unit v cc supply voltage (2) 7 v v i input voltage 7 v output off-state voltage 5.5 v d package 73 db package 82 q ja package thermal impedance (3) c/w n package 67 ns package 64 lead temperature 1,6 mm (1/16 in) from case for 10 s 260 c lead temperature 1,6 mm (1/16 in) from case for 60 s j package 300 c t stg storage temperature range ?65 150 c (1) stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. these are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under "recommended operating conditions" is not implied. exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. (2) all voltage values, except differential output voltage v od , are with respect to network gnd. (3) the package thermal impedance is calculated in accordance with jesd 51-7. 3 submit documentation feedback www .ti.com 22 k w t o three other drivers common to all four drivers gnd enable g enable g v c c v v output y 9 w input a 22 k w 22 k w all resistor values are nominal. output z 9 w
recommended operating conditions electrical characteristics (1) switching characteristics am26ls31c , am26ls31m quadruple differential line driver slls114i ? january 1979 ? revised february 2006 min nom max unit am26ls31c 4.75 5 5.25 v cc supply voltage v am26ls31m 4.5 5 5.5 v ih high-level input voltage 2 v v il low-level input voltage 0.8 v i oh high-level output current ?20 ma i ol low-level output current 20 ma am26ls31c 0 70 t a operating free-air temperature c am26ls31m ?55 125 over operating free-air temperature range (unless otherwise noted) parameter test conditions min typ (2) max unit v ik input clamp voltage v cc = min, i i = ?18 ma ?1.5 v v oh high-level output voltage v cc = min, i oh = ?20 ma 2.5 v v ol low-level output voltage v cc = min, i ol = 20 ma 0.5 v v o = 0.5 v ?20 off-state (high-impedance-state) i oz v cc = min, m a output current v o = 2.5 v 20 i i input current at maximum input voltage v cc = max, v i = 7 v 0.1 ma i ih high-level input current v cc = max, v i = 2.7 v 20 m a i il low-level input current v cc = max, v i = 0.4 v ?0.36 ma i os short-circuit output current (3) v cc = max ?30 ?150 ma i cc supply current v cc = max, all outputs disabled 32 80 ma (1) for c-suffix devices, v cc min = 4.75 v and v cc max = 5.25 v. for m-suffix devices, v cc min = 4.5 v and v cc max = 5.5 v. (2) all typical values are at v cc = 5 v and t a = 25 c. (3) not more than one output should be shorted at a time, and duration of the short circuit should not exceed one second. v cc = 5 v (see figure 1 ) t a = 25 c am26ls31m parameter test conditions unit min typ max min max propagation delay time, low- to t plh 14 20 30 high-level output c l = 30 pf, s1 and s2 open ns propagation delay time, high- to t phl 14 20 30 low-level output t pzh output enable time to high level r l = 75 w 25 40 60 c l = 30 pf ns t pzl output enable time to low level r l = 180 w 37 45 68 t phz output disable time from high level 21 30 45 c l = 10 pf, s1 and s2 closed ns t plz output disable time from low level 23 35 53 t skew output-to-output skew c l = 30 pf, s1 and s2 open 1 6 9 ns 4 submit documentation feedback www .ti.com
parameter measurement information am26ls31c , am26ls31m quadruple differential line driver slls114i ? january 1979 ? revised february 2006 figure 1. test circuit and voltage waveforms 5 submit documentation feedback www .ti.com w aveform 1 (see note e) output z output y input a (see notes b and c) v o l v o h v o l v o h 3 v t p h l skew skew t p l h t p l h t p h l 0 v prop aga tion dela y times and skew test circuit v c c t est point s1s2 75 w 180 w c l (see note a) from output under t est v o h v o l 1.5 v 0 v 3 v enable g enable g (see note d) s1 open s2 closed s1 closed s2 open t p z h t p z l t p h z t p l z s1 closeds2 closed 0.5 v 0 v 4.5 v s1 closeds2 closed 1.5 v enable and disable time w a veforms see note d notes: a. c l includes probe and jig capacitance. b. all input pulses are supplied by generators having the following characteristics: prr 1 mhz, z o 50 w , t r 15 ns, t f 6 ns. c. when measuring propagation delay times and skew , switches s1 and s2 are open. d. each enable is tested separately . e. w aveform 1 is for an output with internal conditions such that the output is low , except when disabled by the output control. w aveform 2 is for an output with internal conditions such that the output is high, except when disabled by the output control. 1.3 v 1.3 v 1.5 v 1.5 v 1.5 v 1.5 v w aveform 2 (see note e) 0.5 v 1.5 v 1.5 v
typical characteristics am26ls31c , am26ls31m quadruple differential line driver slls114i ? january 1979 ? revised february 2006 figure 2. figure 3. figure 4. figure 5. a. the a input is connected to v cc during testing of the y outputs and to ground during testing of the z outputs. b. the a input is connected to ground during testing of the y outputs and to v cc during testing of the z outputs. 6 submit documentation feedback v i ? enable g input v oltage ? v ? output v oltage ? v output vol t age vs enable g input vol t age v o v c c = 5.25 v v c c = 5 v v c c = 4.75 v 43 2 1 0 0 1 2 3 5 6 load = 470 w to v c c t a = 25 c see note b v i ? enable g input v oltage ? v output vol t age vs enable g input vol t age t a = 25 c t a = 0 c t a = 70 c ? output v oltage ? v v o 43 2 1 0 0 1 2 3 5 6 v c c = 5 v load = 470 w to v c c see note b www .ti.com v i ? enable g input v oltage ? v output vol t age vs enable g input vol t age v c c = 5.25 v v c c = 5 v v c c = 4.75 v load = 470 w to gnd t a = 25 c see note a ? y output v oltage ? v v o 43 2 1 0 0 1 2 3 v i ? enable g input v oltage ? v output vol t age vs enable g input vol t age v c c = 5 v load = 470 w to gnd see note a t a = 70 c t a = 0 c t a = 25 c ? y output v oltage ? v v o 43 2 1 0 0 1 2 3
am26ls31c , am26ls31m quadruple differential line driver slls114i ? january 1979 ? revised february 2006 typical characteristics (continued) figure 6. figure 7. figure 8. figure 9. a. the a input is connected to v cc during testing of the y outputs and to ground during testing of the z outputs. b. the a input is connected to ground during testing of the y outputs and to v cc during testing of the z outputs. 7 submit documentation feedback www .ti.com ? high-level output v oltage ? v t a ? free-air t emperature ? c i o h = ?20 ma i o h = ?40 ma high-level output vol t age vs free-air tempera ture v oh v c c = 5 v see note a 43 2 1 0 0 25 50 75 5 i o h ? high-level output current ? ma high-level output vol t age vs high-level output current v c c = 5.25 v v c c = 4.75 v v c c = 5 v t a = 25 c see note a ? high-level output v oltage ? v v oh 43 2 1 0 0 ?20 ?40 ?60 ?80 ?100 ? low-level output v oltage ? v t a ? free-air t emperature ? c v c c = 5 v i o l = 40 ma see note b low -level output vol t age vs free-air tempera ture v ol 0.40.3 0.2 0.1 0 25 50 75 0.5 0 i o l ? low-level output current ? ma low -level output vol t age vs low -level output current v c c = 5.25 v v c c = 4.75 v t a = 25 c see note b ? low-level output v oltage ? v v ol 0.40.3 0.2 0.1 0 40 80 120 0.5 0 100 60 20 0.6 0.7 0.8 0.9 1
am26ls31c , am26ls31m quadruple differential line driver slls114i ? january 1979 ? revised february 2006 typical characteristics (continued) figure 10. figure 11. 8 submit documentation feedback y output vol t age vs da t a input vol t age t a = 25 c no load t a = 0 c t a = 70 c v i ? data input v oltage ? v ? y output v oltage ? v v o 43 2 1 0 0 1 2 3 5 www .ti.com v c c = 5 v v i ? data input v oltage ? v y output vol t age vs da t a input vol t age v c c = 4.75 v no loadt a = 25 c v c c = 5.25 v ? y output v oltage ? v v o 43 2 1 0 0 1 2 3 5
package option addendum www.ti.com 24-jan-2013 addendum-page 1 packaging information orderable device status (1) package type package drawing pins package qty eco plan (2) lead/ball finish msl peak temp (3) op temp (c) top-side markings (4) samples 5962-7802301m2a active lccc fk 20 1 tbd call ti call ti -55 to 125 5962- 7802301m2a am26ls31 mfkb 5962-7802301mea active cdip j 16 1 tbd call ti call ti -55 to 125 5962-7802301me a am26ls31mjb 5962-7802301mfa active cfp w 16 1 tbd call ti call ti -55 to 125 5962-7802301mf a am26ls31mwb 5962-7802301q2a active lccc fk 20 1 tbd post-plate n / a for pkg type 5962- 7802301q2a am26ls31m am26ls31cd active soic d 16 40 green (rohs & no sb/br) cu nipdau level-1-260c-unlim 0 to 70 am26ls31c AM26LS31CDBR active ssop db 16 2000 green (rohs & no sb/br) cu nipdau level-1-260c-unlim 0 to 70 sa31c AM26LS31CDBRe4 active ssop db 16 2000 green (rohs & no sb/br) cu nipdau level-1-260c-unlim 0 to 70 sa31c AM26LS31CDBRg4 active ssop db 16 2000 green (rohs & no sb/br) cu nipdau level-1-260c-unlim 0 to 70 sa31c am26ls31cde4 active soic d 16 40 green (rohs & no sb/br) cu nipdau level-1-260c-unlim 0 to 70 am26ls31c am26ls31cdg4 active soic d 16 40 green (rohs & no sb/br) cu nipdau level-1-260c-unlim 0 to 70 am26ls31c am26ls31cdr active soic d 16 2500 green (rohs & no sb/br) cu nipdau level-1-260c-unlim 0 to 70 am26ls31c am26ls31cdre4 active soic d 16 2500 green (rohs & no sb/br) cu nipdau level-1-260c-unlim 0 to 70 am26ls31c am26ls31cdrg4 active soic d 16 2500 green (rohs & no sb/br) cu nipdau level-1-260c-unlim 0 to 70 am26ls31c am26ls31cn active pdip n 16 25 pb-free (rohs) cu nipdau n / a for pkg type 0 to 70 am26ls31cn am26ls31cne4 active pdip n 16 25 pb-free (rohs) cu nipdau n / a for pkg type 0 to 70 am26ls31cn
package option addendum www.ti.com 24-jan-2013 addendum-page 2 orderable device status (1) package type package drawing pins package qty eco plan (2) lead/ball finish msl peak temp (3) op temp (c) top-side markings (4) samples am26ls31cnsr active so ns 16 2000 green (rohs & no sb/br) cu nipdau level-1-260c-unlim 0 to 70 26ls31 am26ls31cnsrg4 active so ns 16 2000 green (rohs & no sb/br) cu nipdau level-1-260c-unlim 0 to 70 26ls31 am26ls31mfkb active lccc fk 20 1 tbd post-plate n / a for pkg type -55 to 125 5962- 7802301m2a am26ls31 mfkb am26ls31mjb active cdip j 16 1 tbd a42 n / a for pkg type -55 to 125 5962-7802301me a am26ls31mjb am26ls31mwb active cfp w 16 1 tbd a42 n / a for pkg type -55 to 125 5962-7802301mf a am26ls31mwb (1) the marketing status values are defined as follows: active: product device recommended for new designs. lifebuy: ti has announced that the device will be discontinued, and a lifetime-buy period is in effect. nrnd: not recommended for new designs. device is in production to support existing customers, but ti does not recommend using this part in a new design. preview: device has been announced but is not in production. samples may or may not be available. obsolete: ti has discontinued the production of the device. (2) eco plan - the planned eco-friendly classification: pb-free (rohs), pb-free (rohs exempt), or green (rohs & no sb/br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. tbd: the pb-free/green conversion plan has not been defined. pb-free (rohs): ti's terms "lead-free" or "pb-free" mean semiconductor products that are compatible with the current rohs requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. where designed to be soldered at high temperatures, ti pb-free products are suitable for use in specified lead-free processes. pb-free (rohs exempt): this component has a rohs exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. the component is otherwise considered pb-free (rohs compatible) as defined above. green (rohs & no sb/br): ti defines "green" to mean pb-free (rohs compatible), and free of bromine (br) and antimony (sb) based flame retardants (br or sb do not exceed 0.1% by weight in homogeneous material) (3) msl, peak temp. -- the moisture sensitivity level rating according to the jedec industry standard classifications, and peak solder temperature. (4) only one of markings shown within the brackets will appear on the physical device. important information and disclaimer: the information provided on this page represents ti's knowledge and belief as of the date that it is provided. ti bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. efforts are underway to better integrate information from third parties. ti has taken and
package option addendum www.ti.com 24-jan-2013 addendum-page 3 continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. ti and ti suppliers consider certain information to be proprietary, and thus cas numbers and other limited information may not be available for release. in no event shall ti's liability arising out of such information exceed the total purchase price of the ti part(s) at issue in this document sold by ti to customer on an annual basis. other qualified versions of am26ls31, am26ls31m : ? catalog: am26ls31 ? military: am26ls31m note: qualified version definitions: ? catalog - ti's standard catalog product ? military - qml certified for military and defense applications
tape and reel information *all dimensions are nominal device package type package drawing pins spq reel diameter (mm) reel width w1 (mm) a0 (mm) b0 (mm) k0 (mm) p1 (mm) w (mm) pin1 quadrant AM26LS31CDBR ssop db 16 2000 330.0 16.4 8.2 6.6 2.5 12.0 16.0 q1 am26ls31cdr soic d 16 2500 330.0 16.4 6.5 10.3 2.1 8.0 16.0 q1 am26ls31cdr soic d 16 2500 330.0 16.4 6.5 10.3 2.1 8.0 16.0 q1 am26ls31cdrg4 soic d 16 2500 330.0 16.4 6.5 10.3 2.1 8.0 16.0 q1 am26ls31cdrg4 soic d 16 2500 330.0 16.4 6.5 10.3 2.1 8.0 16.0 q1 package materials information www.ti.com 8-apr-2013 pack materials-page 1
*all dimensions are nominal device package type package drawing pins spq length (mm) width (mm) height (mm) AM26LS31CDBR ssop db 16 2000 367.0 367.0 38.0 am26ls31cdr soic d 16 2500 333.2 345.9 28.6 am26ls31cdr soic d 16 2500 367.0 367.0 38.0 am26ls31cdrg4 soic d 16 2500 367.0 367.0 38.0 am26ls31cdrg4 soic d 16 2500 333.2 345.9 28.6 package materials information www.ti.com 8-apr-2013 pack materials-page 2

mechanical data msso002e ? january 1995 ? revised december 2001 post office box 655303 ? dallas, texas 75265 db (r-pdso-g**) plastic small-outline 4040065 /e 12/01 28 pins shown gage plane 8,20 7,40 0,55 0,95 0,25 38 12,90 12,30 28 10,50 24 8,50 seating plane 9,90 7,90 30 10,50 9,90 0,38 5,60 5,00 15 0,22 14 a 28 1 20 16 6,50 6,50 14 0,05 min 5,90 5,90 dim a max a min pins ** 2,00 max 6,90 7,50 0,65 m 0,15 0 ? 8 0,10 0,09 0,25 notes: a. all linear dimensions are in millimeters. b. this drawing is subject to change without notice. c. body dimensions do not include mold flash or protrusion not to exceed 0,15. d. falls within jedec mo-150
important notice texas instruments incorporated and its subsidiaries (ti) reserve the right to make corrections, enhancements, improvements and other changes to its semiconductor products and services per jesd46, latest issue, and to discontinue any product or service per jesd48, latest issue. buyers should obtain the latest relevant information before placing orders and should verify that such information is current and complete. all semiconductor products (also referred to herein as ? components ? ) are sold subject to ti ? s terms and conditions of sale supplied at the time of order acknowledgment. ti warrants performance of its components to the specifications applicable at the time of sale, in accordance with the warranty in ti ? s terms and conditions of sale of semiconductor products. testing and other quality control techniques are used to the extent ti deems necessary to support this warranty. except where mandated by applicable law, testing of all parameters of each component is not necessarily performed. ti assumes no liability for applications assistance or the design of buyers ? products. buyers are responsible for their products and applications using ti components. to minimize the risks associated with buyers ? products and applications, buyers should provide adequate design and operating safeguards. ti does not warrant or represent that any license, either express or implied, is granted under any patent right, copyright, mask work right, or other intellectual property right relating to any combination, machine, or process in which ti components or services are used. information published by ti regarding third-party products or services does not constitute a license to use such products or services or a warranty or endorsement thereof. use of such information may require a license from a third party under the patents or other intellectual property of the third party, or a license from ti under the patents or other intellectual property of ti. reproduction of significant portions of ti information in ti data books or data sheets is permissible only if reproduction is without alteration and is accompanied by all associated warranties, conditions, limitations, and notices. ti is not responsible or liable for such altered documentation. information of third parties may be subject to additional restrictions. resale of ti components or services with statements different from or beyond the parameters stated by ti for that component or service voids all express and any implied warranties for the associated ti component or service and is an unfair and deceptive business practice. ti is not responsible or liable for any such statements. buyer acknowledges and agrees that it is solely responsible for compliance with all legal, regulatory and safety-related requirements concerning its products, and any use of ti components in its applications, notwithstanding any applications-related information or support that may be provided by ti. buyer represents and agrees that it has all the necessary expertise to create and implement safeguards which anticipate dangerous consequences of failures, monitor failures and their consequences, lessen the likelihood of failures that might cause harm and take appropriate remedial actions. buyer will fully indemnify ti and its representatives against any damages arising out of the use of any ti components in safety-critical applications. in some cases, ti components may be promoted specifically to facilitate safety-related applications. with such components, ti ? s goal is to help enable customers to design and create their own end-product solutions that meet applicable functional safety standards and requirements. nonetheless, such components are subject to these terms. no ti components are authorized for use in fda class iii (or similar life-critical medical equipment) unless authorized officers of the parties have executed a special agreement specifically governing such use. only those ti components which ti has specifically designated as military grade or ? enhanced plastic ? are designed and intended for use in military/aerospace applications or environments. buyer acknowledges and agrees that any military or aerospace use of ti components which have not been so designated is solely at the buyer ' s risk, and that buyer is solely responsible for compliance with all legal and regulatory requirements in connection with such use. ti has specifically designated certain components as meeting iso/ts16949 requirements, mainly for automotive use. in any case of use of non-designated products, ti will not be responsible for any failure to meet iso/ts16949. products applications audio www.ti.com/audio automotive and transportation www.ti.com/automotive amplifiers amplifier.ti.com communications and telecom www.ti.com/communications data converters dataconverter.ti.com computers and peripherals www.ti.com/computers dlp ? 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